Laser Services
 
Au Wire Bonding Fast Axis Collimation Laser Chip and Array Placement Flux Free Soldering Vacuum Welding
 
  • Au Wire Bonding on your devices​

  • Scribing/cleaving on your laser wafer, laser array or laser chip

  • Soldering your laser chip or array on you provided heat sink or our heat sink. This is a Flux/Organic free soldering technology.

  • FAC lens your laser chip, ( Fast Axis Collimation )
    ​Hermetically packaging your devices, back fill packages with Nitrogen or other Nobel gases.

  • Laser Testing Services

  • Indium deposition services on your heat sink or carrier.

 

Laser Diode Services

peter@laserdiodeservices.com

 

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